Conference Organizing Committee
General Chairman
Yasukazu Seki
Fuji Electric Systems Co., Ltd.
Vice General Chairman
Gourab Majumdar
Mitsubishi Electric Corporation
Mohamed Darwish
MaxPower Semiconductor Inc.
Peter Moens
On Semiconductor
Technical Program Committee, Chairman
Mutsuhiro Mori
Hitachi, Ltd.
Masayuki Abe
The Kansai Electric Power Co., Inc.
Hirofumi Akagi
Tokyo Institute of Technology
Tsutomu Aoki
NEC Electronics Corporation
Kimimori Hamada
Toyota Motor Corporation
Kunio Iida
ROHM Co., Ltd.
Kunio Ishibashi
The Institute of Electrical Engineers of Japan
Takeshi Ishiguro
ICEMOS Technology
Hidenobu Ito
FUJITSU VLSI LIMITED
Akio Iwabuchi
SANKEN ELECTRIC CO., LTD.
Noriyuki Iwamuro
National Institute of Advanced Industrial Science and Technology
Tsunenobu Kimoto
Kyoto University
Tohru Maruno
NTT Energy and Environment Systems Laboratories
Hirofumi Matsuo
Nagasaki University
Takashi Nishimura
MITSUBISHI ELECTRIC CORPORATION
Tsuneo Ogura
Toshiba Corporation
Hajime Okumura
National Institute of Advanced Industrial Science and Technology
Ichiro Omura
Kyushu Institute of Technology
Shoichi Onda
DENSO CORPORATION
Masakazu Sano
SUMCO CORPORATION
Kunihiko Shibata
Nihon Inter Electronics Corporation
Naohiro Shimizu
NGK Insulators, LTD.
Shinichi Shinohara
Origin ELECTRIC Co., LTD.
Shu Sugisawa
Shin-Etsu Handotai Co., Ltd.
Hiroshi Tadano
TOYOTA Central R&D Labs., Inc.
Yoshihiro Takemae
FUJITSU MICROELECTRONICS LIMITED
Haruto Taniguchi
The University of Tokyo
Wataru Tomoshige
Shindengen Electric Manufacturing Co., Ltd.
Tomoki Watanabe
Railway Technical Research Institute
Toshiaki Yachi
Tokyo University of Science
Yuuji Yamanishi
Panasonic
Tunenori Yamauchi
Nishinippon Institute of Technorogy
Masaru Yamazoe
Fuji Electric Systems Co., Ltd.
Taizo Yoshida
Nihon Synopsys G. K.
Conference Advisory Committee
Michael S. Adler
IEEE
Gehan Amaratunga
Cambrifge University
B. Jayant Baliga
N. Carolina State University
T. Paul Chow
Rensselaer Polytechnic Institute
Taylor Efland
Texas Instruments
Wolfgang Fichtner
Swiss Federal Institute of Technology
Min-Koo Han
Seoul National University
Dan Kinzer
Fairchild Semiconductor
Leo Lorenz
Infineon Technologies
Jose Millán
Centro Nacional de Microelectrónica
Hiromichi Ohashi
Tokyo Institute of Technology
Tadahiro Ohmi
Tohoku University
Masahiro Okamura
Japan Advanced Institute of Science and Technology
C. Andre T. Salama
University of Toronto
Ayman Shibib
Bourns, Inc.
Paolo Spirito
University of Naples
Yoshitaka Sugawara
SiC power electronics network
Yoshiyuki Uchida
Curamik Electronics
Richard Williams
Advanced Analogic Technologies
Toshiaki Yachi
Tokyo University of Science
Conference Steering Committee
Steering Committee, Chairman
Gourab Majumdar
Mitsubishi Electric Corporation
Technical Program Committee, Vice Chairman
Noriyuki Iwamuro
National Institute of Advanced Industrial Science and Technology
Social Arrangement
Hiroshi Nakanishi
Sanken Electric Co., Ltd.
Publicity
Masaki Shiraishi
Hitachi, Ltd.
Treasurer
Satoshi Shiraki
Denso Corporation
Local Arrangement
Yasuhiro Uemoto
Panasonic
Secretariat
Tomoyuki Yamazaki
Fuji Electric Systems Co., Ltd.
Technical Program Committee
Technical Program Committee, Chairman
Mutsuhiro Mori
Hitachi, Ltd.
Technical Program Committee, Vice Chairman
Noriyuki Iwamuro
National Institute of Advanced Industrial Science and Technology
Don Disney
Monolithic Power Systems
Jan Sonsky
NXP Semiconductors
Category 1: High Voltage Power Devices
Category Chairman
Ichiro Omura
Kyushu Institute of Technology (KIT)
Vitezslav Benda
Czech Technical University
Reinhard Herzer
Semikron Elektronik GmbH Nuremberg
Alex Huang
NC State University
Masayasu Ishiko
Toyota Central R&D Labs., Inc.
D. Kinzer
Fairchild Semiconductor
Stefan Linder
ABB Switzerland Ltd, Semiconductors
Leo Lorenz
Infineon Technologies
Mutsuhiro. Mori
Hitachi
Shankar N Ekkanath Madathil
University of Sheffield
Deva Pattanayak
Vishay Siliconix
Jean-Louis Sanchez
LAAS-CNRS
Katsumi Satoh
Mitsubishi Electric
Yasukazu Seki
Fuji Electric
Paolo Spirito
University of Napoli
Hamza Yilmaz
Alpha&Omega Semiconductor
Category 2: Low Voltage Power Devices
Category Chairman
Yusuke Kawaguchi
Toshiba Corporation
C. Andre T. Salama
University of Toronto
Mohamed Darwish
MaxPower Semiconductor Inc.
Gary Dolny
Fairchild Semiconductor
Phil Hower
Texas Instruments
Vishnu Khemka
Freescale Semiconductor
Kenya Kobayashi
NEC Electronics Corporation
S. Matsumoto
NTT
Vijay Parthasarathy
Power Integrations Inc
John Shen
University of Central Florida
Johnny Sin
Hong Kong University of Science and Technology
Jan Sonsky
NXP Semiconductors
Andy Strachan
National Semiconductor
Florin Udrea
Cambridge University
Category 3: New Materal Power Devices
Category Chairman
Noriyuki Iwamuro
National Institute of Advanced Industrial Science and Technology
Hsueh-Rong Chang
International Rectifier
T. Paul Chow
Rensselaer Polytechnic Institute
Min-Koo Han
Seoul National University
Masakatsu Hoshi
Nissan
Nariaki Ikeda
Advanced Power Device R&D association (Furukawa Electric)
Tsunenobu Kimoto
Kyoto University
Phil Mawby
Univeristy of Warwick
Jose Millan
CNM
Peter Moens
ON Semiconductor
Roland Rupp
Infineon Technologies
David Sheridan
SemiSouth Inc.
Yoshitaka Sugawara
SiC power electronics network
Yasuhiro Uemoto
Panasonic
Q. Jon. Zhang
CREE, Inc.
Category 4: Power ICs
Category Chairman
Tomohide Terashima
Mitsubishi Electric
Sujit Banerjee
Power Integrations
Claudio Contiero
STMicroelectronics Srl
Don Disney
Monolithic Power Systems
Ted Letavic
NXP Semiconductors
Sameer Pendharkar
Texas Instruments Inc.
Ayman Shibib
Bourns, Inc.
Wai Tung Ng
University of Toronto
Ronghua Zhu
Freescale Semiconductor
Category 5: Module and Package Technologies
Category Chairman
Kimimori Hamada
Toyota Motor Corporation
Dieter Silber
University of Bremen
